Extended Low-Temperature Plasma-Assisted Bonding Enhances Wafer Bonding Strength Uniformity

Shiming Wu

doi:10.1557/mrs2005.215

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Extended Low-Temperature Plasma-Assisted Bonding Enhances Wafer Bonding Strength Uniformity

Published online by Cambridge University Press: 31 January 2011

Shiming Wu

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Type: Research/Researchers
Information: MRS Bulletin , Volume 30 , Issue 10: Self-Assembly in Materials Synthesis , October 2005 , pp. 688 - 689

DOI: https://doi.org/10.1557/mrs2005.215 [Opens in a new window]
Copyright: Copyright © Materials Research Society 2005

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Extended Low-Temperature Plasma-Assisted Bonding Enhances Wafer Bonding Strength Uniformity

Volume 30, Issue 10
Shiming Wu
DOI: https://doi.org/10.1557/mrs2005.215

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Extended Low-Temperature Plasma-Assisted Bonding Enhances Wafer Bonding Strength Uniformity

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