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Phase-change memory cycling endurance

Published online by Cambridge University Press:  05 September 2019

SangBum Kim ,
Geoffrey W. Burr ,
Wanki Kim  and
Sung-Wook Nam
SangBum Kim
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Republic of Korea, sangbum.kim@snu.ac.kr
Geoffrey W. Burr
Affiliation:
IBM Research–Almaden, USA, gwburr@us.ibm.com
Wanki Kim
Affiliation:
IBM T.J. Watson Research Center, USA, wkim@us.ibm.com
Sung-Wook Nam
Affiliation:
School of Medicine, Kyungpook National University, Republic of Korea, nams@knu.ac.kr
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Abstract

The cycling endurance of phase-change memory is one of the last hurdles to overcome to enable its adoption in the larger market for persistent memory products. Phase-change memory cycling endurance failures, whether they are stuck-SET (caused by elemental segregation) or stuck-RESET (caused by void formation), are caused by atomic migration. Various driving forces responsible for the atomic migration have been identified, such as hole-wind force, electrostatic force, and crystallization-induced segregation. We introduce several strategies to improve cycling endurance based on an understanding of driving forces and interactions among them. Utilizing some of these endurance-improving techniques, record-high phase-change memory cycling endurance at around 1012 cycles has been recently reported using a confined phase-change memory cell with a metallic liner.

Keywords

memoryelectromigrationthermal stresses
Type
Phase-Change Materials in Electronics and Photonics
Information
MRS Bulletin , Volume 44 , Issue 9: Phase-Change Materials in Electronics and Photonics , September 2019 , pp. 710 - 714
Copyright
Copyright © Materials Research Society 2019 

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