Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-29T10:36:28.908Z Has data issue: false hasContentIssue false

Ab-Initio Study of Boron Diffusion Retardation in Si1-xGex

Published online by Cambridge University Press:  01 February 2011

Yonghyun Kim
Affiliation:
ykim3@ece.utexas.edu, The University of Texas at Austin, Microelectronics Research Center, 10100 Burnet Road, Bldg 160, MER 2.608C, Austin, TX, 78758-4445, United States
Taras A. Kirichenko
Affiliation:
Taras.Kirichenko@freescale.com, Freescale Semiconductor, 3501 ED Bluestein Blvd, MD K10, Austin, TX, 78721, United States
Sanjay K. Banerjee
Affiliation:
anupam@uts.cc.utexas.edu, The University of Texas at Austin, Microelectronics Research Center, Austin, TX, 78758, United States
Gyeong S. Hwang
Affiliation:
gshwang@che.utexas.edu, The University of Texas at Austin, Department of Chemical Engineering, Austin, TX, 78712, United States
Get access

Abstract

We study B diffusion in the presence of Ge by using a first principles density functional theory calculation. We investigate the relative stability and migration barriers of Si and Ge interstitials as well as binding energy and diffusion pathway of Boron-Interstitial (BI) pair comprised of Boron and Si or Ge interstitials. We find that Ge interstitials are more stable but less mobile compared to Si interstitials, leading to higher population of interstitials in the implanted Si1-xGex. However, BI pair comprised of Ge interstitial and Boron is less stable compared to Si interstitial –Boron pair and migration barrier of BI pair in presence of Ge is increased, leading to less TED.

Keywords

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 The International Technology Roadmap for Semiconductors (ITRS 2003)Google Scholar
2 Ismail, K., Nelson, S. F., Chu, J. O., and Meyerson, B. S., Appl. Phys. Lett., 63, 660 (1993).Google Scholar
3 Fossum, J. and Zhang, W., IEEE Trans. Electron Devices, 50, 1042 (2003).Google Scholar
4 Thompson, P. and Crosby, R., J. Vac. Sci. Technol. B, 22, 2333 (2004).Google Scholar
5 Satta, A., Simoen, E., Clarysse, T., Janssens, T., Benedetti, A., Jaeger, B. De, Meuris, M., and Vandervorst, W., Appl. Phys. Lett., 87, 172109 (2005).Google Scholar
6 Moroz, V., Oh, Y., Pramanik, D., Graoul, H., and Foad, M, Appl. Phys. Lett., 87, 051908 (2005).Google Scholar
7 Paine, A., Morookz, M., Willoughby, A., Bonar, J., Phyillps, P., Dowsett, M., and Cooke, G., Mater. Sci. Forum 196–201, 345 (1995).Google Scholar
8 Kuo, P., Hoyt, J., Gibbons, J., Turner, J., Jacowitz, R., and Lefforge, D., Mater. Res. Soc. Symp. Proc., 379, 373 (1995).Google Scholar
9 Uppal, S., Willoughby, A., Bonar, J., Evans, A., Cowern, N., Morris, R., and Dowsett, M., Physica B, 308–310, 525 (2001).Google Scholar
10 Cowern, N., Zalm, P., Sluis, P., Gravesteijn, D., and Boer, W., Phys. Rev. Lett., 72, 2585 (1994).Google Scholar
11 Kuo, P., Hoyt, J., Gibbons, J., Turner, J, and Lefforge, D., Appl. Phys. Lett., 66, 580 (1995).Google Scholar
12 Moriya, N., Feldman, L., Luftman, H., King, C., Bevk, J., and Freer, B., Phys. Rev. Lett., 71, 883 (1993).Google Scholar
13 Willoughby, A., Evans, A., Champ, P., Yallup, K., Godfrey, D., and Dowsett, M., J. Appl. Phys., 59, 2392 (1986).Google Scholar
14 Wang, L., Clancy, P., and Murthy, C., Phys. Rev. B, 70, 165206 (2004).Google Scholar
15 Kresse, G. and Hafner, J., Phys. Rev. B 47, RC558 (1993). G. Kresse and J. Furthmuler, Comp. Mat. Sci, 6, 15-50 (1996). G. Kresse and J. Hafner, Phys. Rev. B 48, 13115 (1993). G. Kresse and J. Hafner, Phys. Rev. B 49, 14251 (1994). G. Kresse and J. Furthmuler, Phys. Rev. B 54, 11169 (1996).Google Scholar
16 Jeong, J. and Oshiyama, A., Phys. Rev. B, 64, 235204 (2001)Google Scholar
17 Rafferty, C., Gilmer, G., Jaraiz, M., Eaglesham, D., and Gossmann, H., Appl. Phys. Lett., 68, 2395 (1996).Google Scholar