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Adhesion Strength of CuCr Alloy Films to Polyimide

Published online by Cambridge University Press:  21 February 2011

E. C. Ahn ,
Jin Yu  and
I. S. Park
E. C. Ahn
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, P.O.Box 201, Chongryang, Seoul, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, P.O.Box 201, Chongryang, Seoul, Korea
I. S. Park
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, P.O.Box 201, Chongryang, Seoul, Korea
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Abstract

In the present work, CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide thin films were maintained under 85° C/85%R.H. (T/H) conditions for the reliability measurements. Results showed that the peel strength without T/H treatments increased proportionally with the Cr content in the CuCr alloy layer(x) up to 17 at. %, and then saturated. Among the samples studied, the peel strength decreased with hold time under T/H conditions for all the cases, but most drastically for the sample with x=8.5. The very poor peel strength of that sample (x=8.5) was attributed to the occurrence of interfacial failures which were thought to take place along Cr-oxide/polyimide interfaces.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 55
Copyright
Copyright © Materials Research Society 1995

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References

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