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Application of Dispersed Nano Particles

Published online by Cambridge University Press:  17 March 2011

Masaaki Oda ,
Tomoyuki Abe ,
Toshihiro Suzuki ,
Norimich Saito ,
Hisashi Iwashige  and
Ghalip Kutluk
Masaaki Oda
Affiliation:
Nanoparticle Application Department, Ulvac Corporation 516 Yokota, Sanbu-cho, Sanbugun, Chiba-pref.Japan, 289-1297
Tomoyuki Abe
Affiliation:
Nanoparticle Application Department, Ulvac Corporation 516 Yokota, Sanbu-cho, Sanbugun, Chiba-pref.Japan, 289-1297
Toshihiro Suzuki
Affiliation:
Nanoparticle Application Department, Ulvac Corporation 516 Yokota, Sanbu-cho, Sanbugun, Chiba-pref.Japan, 289-1297
Norimich Saito
Affiliation:
Nanoparticle Application Department, Ulvac Corporation 516 Yokota, Sanbu-cho, Sanbugun, Chiba-pref.Japan, 289-1297
Hisashi Iwashige
Affiliation:
Nanoparticle Application Department, Ulvac Corporation 516 Yokota, Sanbu-cho, Sanbugun, Chiba-pref.Japan, 289-1297
Ghalip Kutluk
Affiliation:
Nanoparticle Application Department, Ulvac Corporation 516 Yokota, Sanbu-cho, Sanbugun, Chiba-pref.Japan, 289-1297
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Abstract

Nano-particles can become one of the best materials for forming thin and fine pitch films at low temperature, if particles are individually dispersed densely in a solvent. Individually dispersed metal(gold, silver, copper) nano-particle(d-nano particle) are formed at a state of suspension in an organic solvent by the modified gas evaporation method where formed particles are covered with an organic surfactant just after their formation. The particle formed by the gas evaporation method are metal impurity free and have a narrow size distribution. This suspension is condensed and used as a formed of solution or paste. D-nano particle solution or paste can be baked at 200-300C to form metal thin films. These has been applied to PDP electrode repairing, coloring of car window glass, a filler of electric conductive resin paste and ULSI interconnection formation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 704: Symposium W – Nanoparticulate Materials , 2001 , W3.1.1
Copyright
Copyright © Materials Research Society 2002

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References

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