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Capacitance Measurement Technique for Determining the Out-of-Plane Coefficient of Thermal Expansion for Low-k Dielectrics

Published online by Cambridge University Press:  01 February 2011

Swarnal Borthakur ,
Andreas Knorr ,
Paul S. Ho  and
Wen-Li Wu
Swarnal Borthakur
Affiliation:
Sematech, The University of Texas at Austin Infineon Technologies
Andreas Knorr
Affiliation:
Sematech, The University of Texas at Austin NIST
Paul S. Ho
Affiliation:
Infineon Technologies
Wen-Li Wu
Affiliation:
Sematech, 2706 Montopolis Drive Austin, TX 78741, USA
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Abstract

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 863: Symposium B – Materials, Technology and Reliability of Advanced Interconnects , 2005 , B8.14
Copyright
Copyright © Materials Research Society 2005

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References

1. Sao, G. D. and Tiwary, H. V., L. Appl. Phys. 53(4), April 1982.Google Scholar
2. Tong, H. M.et al., Rev. Sci. Instrum. 62(2), Feb 1991.Google Scholar
3. Liou, Huey-Chiang, Ph.D. Dissertation, Dept. of Chem. Engg., UT Austin, 1996.Google Scholar
4. Liou, Huey-Chiang, Ho, Paul S., Stierman, Roger, Thin Solid Films, 339, 68–73 (1999).Google Scholar
5. Wu, Wen-Li and Liou, Huey-Chiang, Thin Solid Films, 312, 73–77 (1998).Google Scholar