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Characteristics of Lateral Capacitor Based on High-K Materials
Published online by Cambridge University Press: 01 February 2011
Abstract
In order to take advantage of continued interconnect scaling dimensions in very large scale integrated circuit technology, lateral capacitors with BST dielectric have been proposed. The lateral capacitors have been implemented by platinum/titanium metallization patterned by standard photolithographic techniques and ion-milling. The high-K dielectric BST has been deposited by spin-on MOD and radio frequency magnetron sputtering. The capacitance of lateral capacitor was found to increase with increase in thickness of BST and annealing temperature. The negative temperature dependence capacitance above room temperature shows that BST is in para-electric phase.
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- Copyright © Materials Research Society 2006
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