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Characterization and Use of Polyfluorosiloxanes in Automotive Applications

Published online by Cambridge University Press:  15 February 2011

Anthony Polak
Anthony Polak*
Affiliation:
Motorola Inc. AIEG, 4000 Commercial Ave., Northbrook, Il. 60062
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Abstract

Polysiloxanes are routinely used in the semiconductor industry as die encapsulants. Thermal analysis, NMR, ion chromatography, and dielectric spectroscopy was used to characterize these polymers. The dielectric loss spectrum was found to be directly related to the long term electrical stability of the encapsulated die, and was also found to be a more sensitive technique for determining the concentration of electronically active impurities than GC/MS, and ion chromatography. Dielectric spectroscopy was also used to study the diffusion of acids, and water, through these polymers. While the solubility of acids and water in these materials is low, their diffusion constants are high, on the order of 10−4 cm2/s. In addition, the interaction of the encapsulant with the silicon nitride passivation used on the die surface was found to have an effect on the long term stability of the device. This is believed to be due to the formation of a conductive layer at the silicon nitride/polymer interface which ultimately forms a leakage path between the bond pads, or into the silicon nitride passivation layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 281
Copyright
Copyright © Materials Research Society 1992

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References

1. Wong, C. P., Journal of Electronic Packaging 111, 97 (1989).Google Scholar
2. Wong, C. P., in Advances In Polymer Science-Electronic Applications 84 (Springer-Verlag Berlin Heidelberg, 1988), p. 63.Google Scholar
3. Friedel, C. and Crafts, J. M., Liebigs Ann. Chem. 127, 31 (1863).Google Scholar
4. Friedel, C. and Crafts, J. M., Liebigs Ann. Chem. 136, 302 (1865).Google Scholar
5. Friedel, C. and Crafts, J. M., Ann. Chem. Phys. 19(5), 334 (1870).Google Scholar
6. Rochow, E. G., U. S. Patent No. 2,380,995 (1941).Google Scholar
7. Budhani, R. C., Prakash, S., Doerr, H. J., and Bundshah, R. F., J. Vac. Sci. Technol. A 5, 1644 (1987).Google Scholar
8. Lanford, W. A. and Rand, M. J., J. Appl. Phys. 49, 2473 (1978).Google Scholar
9. Day, D. R., Lewis, T. J., Lee, H. L., and Senturia, S. D., J. Adhesion 18, 73 (1985).Google Scholar
10. Bauerle, J. E., J. Phys. Chem. Solids 30, 2657 (1969).Google Scholar
11. Takahashi, K. M., J. Appl. Phys. 67, 3419 (1990).Google Scholar
12. Petty-Weeks, S. and Polak, A. J., Sensors and Actuators 11, 377 (1987).Google Scholar
13. Denton, D. D., Day, D. R., Priore, D. F., and Senturia, S. D., J. Elect. Materials 14, 119 (1985).Google Scholar