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Characterization of Epoxy-Functionalized Silsesquioxanes as Potential Underfill Encapsulants

Published online by Cambridge University Press:  10 February 2011

E. K. Lin ,
C. R. Snyder ,
F. I. Mopsik ,
W. E. Wallace ,
W. L. Wu ,
C. X. Zhang  and
R. M. Laine
E. K. Lin
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899
C. R. Snyder
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899
F. I. Mopsik
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899
W. E. Wallace
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899
W. L. Wu
Affiliation:
Polymers Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899
C. X. Zhang
Affiliation:
Depts. of Material Science, Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, MI, 48109-2136.
R. M. Laine
Affiliation:
Depts. of Material Science, Chemistry, and the Macromolecular Science and Engineering Center, University of Michigan, Ann Arbor, MI, 48109-2136.
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Abstract

In electronics packaging, underfill encapsulants are needed to improve package reliability in flip-chip devices. The underfill generally consists of an epoxy resin highly filled with silica particles and is designed to reduce the stress arising from the difference in the thermal expansion between the solder bumps and the substrate. Currently, concerns about the flow of the silica particles and surface phenomena are arising as electronics packages reduce in size. Newly developed epoxy-functionalized octameric silsesquioxanes provide an intriguing alternative to current formulations. These single-phase inorganic/organic hybrid materials may have properties similar to filled materials without the complications from the rheology of filled materials. The physical properties of the functionalized silsesquioxanes are measured with respect to the critical parameters for underfill materials. Measurements of properties such as the coefficient of thermal expansion and density are performed to evaluate the suitability of these materials as potential underfill encapsulants.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 519: Symposium O – Organic/Inorganic Hybrid Materials , 1998 , 15
Copyright
Copyright © Materials Research Society 1998

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