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Corrosion Engineering in Device Packaging

Published online by Cambridge University Press:  25 February 2011

R.M. Latanision ,
P.V. Nagarkar ,
M. Kloppers  and
F. Bellucci
R.M. Latanision
Affiliation:
The H.H. Uhlig Corrosion Laboratory, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, USA
P.V. Nagarkar
Affiliation:
The H.H. Uhlig Corrosion Laboratory, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, USA
M. Kloppers
Affiliation:
The H.H. Uhlig Corrosion Laboratory, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, USA
F. Bellucci
Affiliation:
The H.H. Uhlig Corrosion Laboratory, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, USA University of Naples, Naples, ITALY
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Abstract

Corrosion processes affecting electronic devices are chemical and electrochemical in nature. Ionic contaminants, applied voltages, and relative humidity accelerate failure of integrated circuits. Although packaging materials often reduce the corrosion rate of the underlying circuitry, a complete understanding of the mechanism for the basic processes taking place at the coating/metallic circuitry interface is missing.

In this paper the role played by water and ionic contaminants on coated metallic substrates is considered. Transport properties of free standing polyimide membranes have been examined. The corrosion behavior of polyimide/Fe and polyimide/Al systems has been investigated using electrochemical polarization, and a.c. impedance measurements. For the AI/PI system underfilm degradation has been examined using x-ray photoelectron spectroscopy (XPS). Results indicate that the flux of ions is very small compared to that of oxygen and water and yet metallic failure can be ascribed mainly to the transport of ions across the packaging material. XPS showed that considerable degradation takes place at the metal/polyimide interface prior to visible corrosion or delamination.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 87
Copyright
Copyright © Materials Research Society 1991

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References

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