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Defects Near the Y2BaCuO5/YBa2Cu3O7−x Interface and their Effect on Flux-Pinning in Melt-Processed and Quench-Melt-Growth Processed YBa2Cu3O7−x

Published online by Cambridge University Press:  26 February 2011

Z. L. Wang ,
A. Goyal ,
D. M. Kroeger  and
T. Armstrong
Z. L. Wang
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, P.O. Box 2008, Oak Ridge, TN 37831–6376;
A. Goyal
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, P.O. Box 2008, Oak Ridge, TN 37831–6376;
D. M. Kroeger
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, P.O. Box 2008, Oak Ridge, TN 37831–6376;
T. Armstrong
Affiliation:
Allied-Signal Aerospace Co., AiResearch Los Angeles Division, 2525 West 190th St., P. O. Box 2960, Torrance, CA 90509.
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Abstract

A detailed examination of the Y2BaCuO5 (211)/ YBa2Cu3O7−x (123) interface in several melt-processed 123 samples prepared using different methods was undertaken using analytical electron microscopy. It is found that there exists a significant increase in the a-b planar stacking fault density in 123, near the 211/123 interface. When viewed along [001], these faults appear as disks with diameter from a few to 30 nm and are bounded by dislocation loops. Most stacking faults are confined to the (001) basal plane. The size and density of defects around the 211 particles suggest that these defects could act as effective flux-pinning sites and may explain the observations of increased Jc with increasing volume fraction of 211 and a maximum in Jc when the applied field parallel to the c-axis.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 275: Symposium S – Layered Superconductors: Fabrication, Properties and Applications , 1992 , 181
Copyright
Copyright © Materials Research Society 1992

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References

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