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Determination of the Mechanical Properties OP Integrated Circuit Packaging Materials using a Focused Acoustic Beam Technique

Published online by Cambridge University Press:  22 February 2011

De Zhang  and
Gabriel M. Crean
De Zhang
Affiliation:
National Microelectronics Research Centre, Prospect Row, Cork, Ireland
Gabriel M. Crean
Affiliation:
National Microelectronics Research Centre, Prospect Row, Cork, Ireland
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Abstract

A novel method for the measurement of the mechanical properties of integrated circuit interconnection and packaging materials using a conventional acoustic microscope lens, is presented in this paper. This technique allows the simultaneous generation and detection of longitudinal (LW) and shear (SH) acoustic waves in a material system based upon acoustic mode conversion principles at a water-solid interface. Experimental results obtained using a 50 MHz acoustic lens are presented for a range of ceramic materials and compared with published data. Acoustic ray propagation theory is employed to analyse the experimental results.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 281
Copyright
Copyright © Materials Research Society 1992

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References

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