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Effects of hydrothermal aging on the dielectric properties of epoxy molding compounds

Published online by Cambridge University Press:  21 March 2011

Patrice Gonon ,
Alain Sylvestre ,
Jérôme Teysseyre  and
Christophe Prior
Patrice Gonon
Affiliation:
Lab. for Electrostatics and Dielectric Materials., University of Grenoble and French, National Center for Scientific Research. LEMD-CNRS, BP 166, 38042 Grenoble Cedex 9, France. (E-mail: gonon@polycnrs-gre.fr)
Alain Sylvestre
Affiliation:
Lab. for Electrostatics and Dielectric Materials., University of Grenoble and French, National Center for Scientific Research. LEMD-CNRS, BP 166, 38042 Grenoble Cedex 9, France. (E-mail: gonon@polycnrs-gre.fr)
Jérôme Teysseyre
Affiliation:
Corporate Package Development, ST Microelectronics. BP 217, 38019 Grenoble Cedex, France
Christophe Prior
Affiliation:
Corporate Package Development, ST Microelectronics. BP 217, 38019 Grenoble Cedex, France
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Abstract

We studied the influence of hydrothermal aging on the dielectric properties of epoxy molding compounds used for integrated circuits packaging. Samples were subjected to two different aging (JEDEC 1 and JEDEC 3 procedures, followed by a thermal stress at 240°C for a few minutes). Resistance to aging was studied as a function of crosslinking density. Water uptake increases with crosslinking. Aging leads to a reduction in the dielectric constant and to an increase in the loss factor. Post-mold curing is found to slightly enhance the resistance against hydrothermal aging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N1.5
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1. Apicella, A., Egiziano, L., Nicolais, L., Tucci, V., J. Materials Science 23, 729 (1988).Google Scholar
2. Yamanaka, S., Kawamura, H., Ezoe, M., Tada, M., Eleventh International Symposium on High Voltage Engineering (Conf. Publ. No.467), IEE, London, UK, 1999, vol.4, p.67.Google Scholar
3. Marsh, L.L., Hart, D.C Van, Kotkiewicz, S.M., IBM J. Research and Development 29, 18 (1985).Google Scholar
4. Reid, J.D., Lawrence, W.H., Buck, R.P., J. Applied Polymer Science 31, 1771 (1986).Google Scholar
5. Ivanova, K.I., Pethrick, R.A., Affrossman, S., Polymer 41, 6787(2000).Google Scholar
6. Ko, M. and Kim, M., J. Applied Polymer Science 69, 2187 (1998).Google Scholar
7. Diamant, Y., Marom, G., Broutman, L.J., J. Applied Polymer Science 26, 3015 (1981).Google Scholar
8. Kasturiarachchi, K.A., Pritchard, G., J. Materials Science 20, 2038 (1985).Google Scholar
9. Janssen, H., Seifert, J.M., Karner, H.C., IEEE Transactions on Dielectrics and Electrical Insulation 6, 651 (1999).Google Scholar
10. Grave, C., McEwan, I., Pethrick, R.A., J. Applied Polymer Science 69, 2369 (1998).Google Scholar
11. Maxwell, I., Pethrick, R.A., J. Applied Polymer Science 28, 2363 (1983).Google Scholar