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High Efficiency Heat Sinks from Polycrystalline Diamond Grown by CVD Method

Published online by Cambridge University Press:  01 February 2011

Oleg A. Voronov ,
Gary S. Tompa  and
Veronika Veress
Oleg A. Voronov
Affiliation:
Structured Materials Industries, Inc., R&D, 201 Circle Drive North, Unit 102/103, Piscataway, NJ, 08854, United States, 732-302-9274, 732-302-9275
Gary S. Tompa
Affiliation:
gstompa@aol.com, Diamond Materials Inc., 120 Centennial Ave., Piscataway, NJ, 08854, United States
Veronika Veress
Affiliation:
ovoronov@aol.com, Diamond Materials Inc., 120 Centennial Ave., Piscataway, NJ, 08854, United States
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Abstract

While absolute power levels in microelectronic devices are relatively modest (a few tens to a few hundred watts), heat fluxes can be significant (through 50 W/cm2 in current electronic chips and up to 2000 W/cm2 in semiconductor lasers). Diamond heat sinks enable heat transfer rates well above what is possible with standard thermal management devices. We have fabricated heat sinks using diamond, which has the highest temperature thermal conductivity of any known material. Polycrystalline diamonds manufactured by chemical vapor deposition (CVD) are machined by laser and combined with metallic or ceramic tiles. Cooling by fluid flow through micro-channels enhances heat removal. These unique attributes make diamond based heat sinks prime contenders for the next generation of high heat load sinks. Such devices could be utilized for efficient cooling in a variety of applications requiring high heat transfer capability, including semiconductor lasers, microprocessors, multi-chip modules in computers, laser-diode arrays, radar systems, and high-flux optics, among other applications. This paper will review test designs, heat flux measuring system, and measured heat removal values.

Keywords

diamondchemical vapor deposition (CVD) (chemical reaction)thermal conductivity
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 956: Symposium J – Diamond Electronics—Fundamentals to Applications , 2006 , 0956-J08-04
Copyright
Copyright © Materials Research Society 2007

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