Hostname: page-component-6bf8c574d5-2jptb Total loading time: 0 Render date: 2025-02-22T17:02:55.901Z Has data issue: false hasContentIssue false
  • English
  • Français

Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints

Published online by Cambridge University Press:  25 February 2011

Sheera Knecht
Sheera Knecht*
Affiliation:
Digital Equipment Corporation, Andover, MA 01810
Get access

Abstract

The matrix creep failure indicator developed by Shine and Fox is extended to cases when strain is multiaxial and varies with position in the structure. Analysis of a thermal fatigue test of leaded surface mount devices found in the literature illustrates application of the method. A butt joint surface mount configuration is then tested in simple mechanical loading and also analyzed using the finite element method. It is found that the matrix creep “damage integral” method gives good correlation with observed solder fatigue failures for both cases.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 411
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Knecht, S. and Fox, L.R., “Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder,” IEEE Trans. Comp., Hybrids, Manuf. Technol. vol. CHMT–13, pp. 424–433, 1990.Google Scholar
2. Shine, M.C. and Fox, L.R., “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue - ASTM Special Technical Publication 942, 1987, pp. 588–610.Google Scholar
3. Engelmaier, W. and Attarwala, A.I., “Surface-Mount Attachment Reliability of Clip-Leaded Ceramic Chip Carriers on FR-4 Circuit Boards,” IEEE Trans. Comp., Hybrids, Manuf. Technol. Vol. CHMT–12, pp. 284–296, 1989.Google Scholar
4. Knott, J.F., Fundamentals of Fracture Mechanics, Wiley, 1973.Google Scholar
5. Iannuzzelli, R., “Validation of Module Assembly Physical Models,” 40th Electronic Components and Technology Conference, May 21-23, 1990.Google Scholar
6. ABAQUS v.4.8, Hibbitt, Carlsson, and Sorenson, 1989.Google Scholar