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Integration of a Polymer Etch Stop Layer in a Porous Low K MLM Structure

Published online by Cambridge University Press:  01 February 2011

Gregory C. Smith ,
Neil Henis ,
Richard McGowan ,
Brian White ,
Matthias Kraatz ,
Sri Satyanarayana ,
Sharath Hosali ,
Youfan Liu  and
Klaus Pfeifer
Gregory C. Smith
Affiliation:
SEMATECH, Austin Texas
Neil Henis
Affiliation:
SEMATECH, Austin Texas
Richard McGowan
Affiliation:
SEMATECH, Austin Texas
Brian White
Affiliation:
Advanced Micro Devices Assignee at SEMATECH, Austin Texas
Matthias Kraatz
Affiliation:
SEMATECH, Austin Texas University of Texas, Austin, Texas
Sri Satyanarayana
Affiliation:
SEMATECH, Austin Texas
Sharath Hosali
Affiliation:
SEMATECH, Austin Texas
Youfan Liu
Affiliation:
Intel Assignee at SEMATECH, Austin, Texas
Klaus Pfeifer
Affiliation:
SEMATECH, Austin Texas
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Abstract

Two level metal structures were fabricated to test the efficacy of using an organic low K etch stop layer (OESL) in order to lower the effective dielectric constant for intralayer capacitance. The organic etch stop layer's intrinsic capacitance of 3.3 compares with that of silicon carbide (∼ 5) which constitutes the control of the experiment. This reduction represents a reduction of effective dielectric constant for the stack of about 10% to about 3.0. The process was optimized so as to achieve yield of via chains of a million 130 nm diameter vias, and effective K was measured. The target of 3.0 was achieved using this process. Interpenetration of the organic etch stop with the MSQ porous low K material was observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 863: Symposium B – Materials, Technology and Reliability of Advanced Interconnects , 2005 , B2.11
Copyright
Copyright © Materials Research Society 2005

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References

1. Furukawa, Y., Kokubo, T., Struyf, H., Maenhoudt, M., Vanhaelemeersh, S., Gravesteijn, D., “Dual Damascene Patterning for Full Spin-on Stack of Porous Low-K Material”, (Proc. IEEE 2002 IITC), pp.45–47.Google Scholar
2. McGowan, R., Wang, D., Wolf, P. J., “Integration of an Ultra Low-K Dielectric an a 300 mm 130 nm Trench First Dual Damascene Etch Process”, AVS 51st International Symposium, November, 2004.Google Scholar