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Interface Adhesion and Reliability of Microsystem Packaging

Published online by Cambridge University Press:  01 February 2011

Marvin I. Francis ,
Kellen Wadach ,
Satyajit Walwadkar  and
Junghyun Cho
Marvin I. Francis
Affiliation:
Dept. of Mechanical and Materials Engineering, State University of New York, Binghamton, NY 13902–6000
Kellen Wadach
Affiliation:
Dept. of Mechanical and Materials Engineering, State University of New York, Binghamton, NY 13902–6000
Satyajit Walwadkar
Affiliation:
Dept. of Mechanical and Materials Engineering, State University of New York, Binghamton, NY 13902–6000
Junghyun Cho
Affiliation:
Dept. of Mechanical and Materials Engineering, State University of New York, Binghamton, NY 13902–6000
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Abstract

Flip-chip technology is becoming one of the most promising packaging techniques for high performance packages. Solder balls are used as the connection technique in the flip-chip method and the connections are reinforced by filling in the spacing between the chip and substrate with underfill. The function of the underfill is to reduce the stresses in the solder joints caused by a coefficient of thermal expansion (CTE) mismatch. The presence of polymeric underfill material will, however, make the flip-chip packaging system susceptible to interfacial failure. Thus, the purpose of this study is to examine the interfacial delamination between the dissimilar materials in order to increase the reliability of the flip-chip interconnection method, and to understand the effect of underfill curing conditions on the interface adhesion. In particular, we use a linear elastic fracture mechanics (LEFM) approach to assess interfacial toughness. For this purpose, four-point bending testing is performed to determine a critical strain energy release rate, Gc. In addition, nano-indentation testing equipped with atomic force microscope (AFM) is employed to determine structure and properties of the underfill layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 782: Symposium A – Micro- and Nanosystems , 2003 , A5.64
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

[1] Reichl, H., Shubert, M., and Tropper, M., Microelectron Rel., 40, 1243–54 (2000).Google Scholar
[2] Chen, Z., Cottrell, B. and Chen, W. T., Surf. Interface Anal., 28, 146–49 (1999).Google Scholar
[3] Park, C. E., Han, B. J., and Bair, H. E., Polymer, 38 [15] 3811–18 (1997).Google Scholar
[4] Haque, S. and Lu, G.-Q., Microelectro. Rel., 41, 639–47 (2001).Google Scholar
[5] Wang, J., Zou, D., Lu, M., Ren, W., and Liu, S., Eng. Fract. Mech., 64, 781–97 (1999).Google Scholar
[6] Dauskardt, R.H., Lane, M., Ma, Q., Krishna, N., Engineering Fracture Mechanics, 61, 141–162 (1998).Google Scholar
[7] Hohlfelder, R.J., Maidenberg, D.A., Dauskardt, R.H., J. Mater. Res., 16, 1 (2001).Google Scholar
[8] Wang, L. and Dauskardt, R.H., Mat. Res. Soc. Symp. Proc., Vol. 682E, 1–6, 2002.Google Scholar
[9] Volinsky, A. A., Moody, N. R., and Gerberich, W. W., Acta Mater., 50, 441–66 (2002).Google Scholar
[10] Ma, Q., J. Mater. Res., 12 [3] 840–45 (1997).Google Scholar
[11] Doerner, M. F. and Nix, W. D., J. Mater. Res., 1, 601 (1986).Google Scholar
[12] Oliver, W. C. and Pharr, G. M., J. Mater. Res., 7 [6] 156483 (1992).Google Scholar