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Ion Beam Deposition of Epitaxial Silicon Films
Published online by Cambridge University Press: 10 February 2011
Abstract
Silicon films of thicknesses (100 – 800 nm) are deposited on Si[111] substrate at 490°C using Si+ ions of energies (20 – 70 eV) from Silane plasma. The structure of the films depends on the energy of Si+ ions and the film grows epitaxially for ion energy <20 eV. Si films are analyzed by X-ray diffraction technique.
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- Copyright © Materials Research Society 1998
References
1.
Miyake, K. and Tokuyama, T. in Ion Beam Assisted Film Growth, edited by Itoh, T. (Elsevier, Amsterdam, 1989) chap. 8, p. 289.Google Scholar
2.
Zuhr, R.A., Appleton, B.R., Herbets, N., Larson, B.C., Noggle, T.S. and Pennycook, S.J., J. Vac. Sci. Technol.
A5, 2135 (1987).Google Scholar
3.
Lee, N.E., Tomasch, G.A., Xue, G., Market, L.C. and Greene, J.E., Appl. Phys. Lett.
64, 1398 (1994).Google Scholar
7.
Rabalais, J.W., AI-Bayati, A.H., Boyd, K.J., Marton, D., Kulik, J., Zhang, Z. and Chu, W.K., Phys. Rev. B
53, 10781 (1996).Google Scholar
9.
Khan, H.R., Frey, H. and Banhart, F., Nuclear Instruments and Methods in Physics Research B
112, 289 (1996).Google Scholar
11.
Cullity, B.D., Elements of X-ray Diffraction, Addison Weseley, Reading, MA, 1978, p. 284.Google Scholar