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Microhardness Characterization of 80/20 MOL % TiO2/SiO2 Sol-Gel Films

Published online by Cambridge University Press:  22 February 2011

S. M. Melpolder ,
A. W. West  and
C. L. Bauer
S. M. Melpolder
Affiliation:
Eastman Kodak Company, Manufacturing Research and Engineering Organization, Rochester, New York, 14650–2019.
A. W. West
Affiliation:
Eastman Kodak Company, Manufacturing Research and Engineering Organization, Rochester, New York, 14650–2019.
C. L. Bauer
Affiliation:
Eastman Kodak Company, Manufacturing Research and Engineering Organization, Rochester, New York, 14650–2019.
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Abstract

Knoop hardness and nanoindentation studies were performed on single and multilayered 80/20 mol % TiO2/SiO2 films spin-coated onto [100] silicon wafers. The Knoop microhardness results indicated that a total sol-gel thickness (h) to indentation depth (h*) ratio of >2 was sufficient to obtain reliable thin film properties independent of substrate influence. Electron microscopy techniques were used to determine the sample's absolute film thickness, to examine the morphology of the indentations, and to determine the phase of the sol-gel thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 371
Copyright
Copyright © Materials Research Society 1992

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References

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