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A Microstructural Investigation into the Effect of the Ambient Atmosphere on Chromium/Polyimide Interfaces

Published online by Cambridge University Press:  25 February 2011

S.R. Peddada ,
I.M. Robertson  and
H.K. Birnbaum
S.R. Peddada
Affiliation:
Dept. of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801.
I.M. Robertson
Affiliation:
Dept. of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801.
H.K. Birnbaum
Affiliation:
Dept. of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801.
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Abstract

This paper describes the effect of the ambient atmosphere (air, vacuum and deuterium) during thermal cycling on chromium/polyimide (Cr/PI) interfaces. Cross-section TEM has been employed to reveal the interface microstructure and morphology. The extent of interdiffusion across the metal/polyimide interface was determined by Energy Dispersive Spectroscopy in the STEM. The nature of the mechanical failure was identified by SEM and the locus of failure determined by Auger Electron Spectroscopy. It was observed that in the Cr/Cu/Cr/PI/Si system, tensile cracks form in the metal layers that originate at the Cr/PI interface after thermal cycling in any of the ambient atmosphere. Also, after annealing, the Cr/PI interface remains sharp, with no significant diffusion of Cr across the interface, irrespective of the ambient atmosphere.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 181: Symposium B – Advanced Metallizations in Microelectronics , 1990 , 85
Copyright
Copyright © Materials Research Society 1990

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References

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