Hostname: page-component-745bb68f8f-s22k5 Total loading time: 0 Render date: 2025-01-15T01:10:42.535Z Has data issue: false hasContentIssue false
  • English
  • Français

Multiple Wafer Bonding for MEMS Applications

Published online by Cambridge University Press:  21 March 2011

M. Reiche ,
M. Haueis ,
J. Dual ,
C. Cavalloni  and
R. Buser
M. Reiche
Affiliation:
Max-Planck-Institut für Mikrostrukturphysik, Weinberg 2, D – 06120 Halle, Germany
M. Haueis
Affiliation:
ETH Zürich, Institute of Mechanics, Tannenstraße 3, CH – 8092 Zürich, Switzerland
J. Dual
Affiliation:
ETH Zürich, Institute of Mechanics, Tannenstraße 3, CH – 8092 Zürich, Switzerland
C. Cavalloni
Affiliation:
Kistler Instrumente AG, CH – 8408 Winterthur, Switzerland
R. Buser
Affiliation:
Interstate University of Applied Science Buchs, CH – 9471 Buchs, Switzerland
Get access

Abstract

Most of the microelectromechanical systems (MEMS) require a 3-dimensional architecture which can efficiently be realized by multiple semiconductor wafer direct bonding. The present paper demonstrates the method on a force sensor for high resolution measurements of static loads. To minimize temperature stress an all-in silicon solution was developed in contrast to micromachined resonant force sensors published already in the literature.

The presented force sensor integrates load coupling, the excitation and detection of the vibration of the microresonator in one and the same single crystal silicon package. First measurements proved a sensitivity of 26 Hz/N and a resolution better than 3 mN.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 681: Symposium I – Wafer Bonding and Thinning Techniques for Materials Integration , 2001 , I7.2
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Blom, F.R., “Resonant silicon beam force sensor“, Ph.D. Thesis, University of Twente, 1989 Google Scholar
2. Tilmans, H., “Micro-mechanical sensors using encapsulated built-in resonant strain gauges”, Ph. D. Thesis, University of Twente, 1993 Google Scholar
3. Buser, R., Rooij, N. de, IEEE Proceedings, 94 (1989)Google Scholar
4. Haueis, M., Dual, J., Cavalloni, C., Gnielka, M., and Buser, R. in Micro Systems Technologies 2001, edited by Reichl, H. (VDE Verlag, Berlin, Offenbach, 2001) pp. 261–266 Google Scholar
5. Haueis, M., Gnielka, M., J. von Berg, Dual, J., Cavalloni, C., and Buser, R., Transducers 2001 (2001) (in press)Google Scholar
6. Gösele, U. and Recent, M. Reiche Developments in Semiconductor Wafer Bonding for SOI, Proceedings of the Silicon-On-Insulator Conference, SEMICON Europa 2000, Munich, April 4, 2000 Google Scholar