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Published online by Cambridge University Press: 03 September 2012
The relationship between electrical properties and microstructure of pure Zn and Au(Zn) contacts to p-GaAs has been studied. Thermally activated changes in ФB correlate with structural processes at MS interfaces. For Zn/GaAs contacts, lowering of ФB from 0.63 eV to 0.35 eV corresponds to the penetration of Zn into the native oxide layer. In AuZn/p-GaAs contacts, β-AuZn phase is responsible for the formation of ФB=0.4 eV in as-deposited contacts. The onset of the ohmic behaviour of Au(Zn)/p-GaAs contacts (ФB=0.3 eV) coincides with the appearance of α3-AuZn phase for Zn content less than 20 at.% or α1-AuZn, for higher Zn concentrations.
The obtained results prove that the mechanism responsible for the formation of low-resistance Zn -based contacts to p-type GaAs is associated with the lowering of the Schottky barrier at the metal/semiconductor interface. We suggest that the ultimate properties of these contacts are determined by the presence of a single, specific phase in a direct contact with the semiconductor.