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Published online by Cambridge University Press: 21 February 2011
The light ion impurities C, O and H have been implanted or diffused into GaN and related compounds and their effect on the electrical properties of these materials measured by Hall, C-V and SIMS as a function of annealing temperatures from 300-1100ºC. While C in as-grown GaN appears to create an acceptor under MOMBE conditions, implanted C shows no measurable activity. Similarly, implanted O does not show any shallow donor activity after annealing at ≤ 700°C, but can create high resistivity regions (106 Ω/□) in GaN, AlInN and InGaN for device isolation when annealed at 500–700°C. Finally, hydrogen is found to passivate shallow donor and acceptor states in GaN, InN, InAIN and InGaN, with dissociation of the neutral complexes at >450°C. The liberated hydrogen does not leave the nitride films until much higher annealing temperatures (>800°C). Typical reactivation energies are ∼2.0eV for impurity-hydrogen complexes.