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Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum alloy Lines

Published online by Cambridge University Press:  21 February 2011

Paul R. Besser ,
Thomas N. Marieb  and
John C. Bravman
Paul R. Besser
Affiliation:
Materials Science and Engineering Department, Stanford University, Stanford, CA 94305
Thomas N. Marieb
Affiliation:
Materials Science and Engineering Department, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Materials Science and Engineering Department, Stanford University, Stanford, CA 94305
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Abstract

Strain relaxation in passivated Al-0.5% Cu lines was measured using X-ray diffraction coupled with in-situ observation of the formation and growth of stress induced voids. Samples of 1 μm thick Al-0.5% Cu lines passivated with Si3N4 were heated to 380°C, then cooled and held at 150°C. During the test, principal strains along the length, width, and height of the line were determined using a grazing incidence x-ray geometry. From these measurements the hydrostatic strain in the metal was calculated and strain relaxation was observed. The thermal cycle was duplicated in a high voltage scanning transmission electron microscope equipped with a backscattered electron detector. The 1.25 μm wide lines were seen to have initial stress voids. Upon heating these voids reduced in size until no longer observable. Once the samples were cooled to 150°C, voids reappeared and grew. The measured strain relaxation is discussed in terms of void and θ-phase (Al2Cu) formation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 181
Copyright
Copyright © Materials Research Society 1993

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