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Studies of Copper Surfaces modified by Thermal and Plasma Treatments

Published online by Cambridge University Press:  17 March 2011

G.P. Beyer ,
M. Baklanov ,
T. Conard  and
K. Maex
G.P. Beyer
Affiliation:
Imec Kapeldreef 75 3001 Leuven, BELGIUM
M. Baklanov
Affiliation:
Imec Kapeldreef 75 3001 Leuven, BELGIUM
T. Conard
Affiliation:
Imec Kapeldreef 75 3001 Leuven, BELGIUM
K. Maex
Affiliation:
Imec Kapeldreef 75 3001 Leuven, BELGIUM
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Abstract

It was found that copper surfaces, which had been exposed to a clean room atmosphere, were covered by a layer, whose chemical composition can be described by Cu(OH)2·CuCO3. This layer can effectively be removed by either a short thermal treatment in vacuum at 350°C, a hydrogen plasma treatment, or a combination of both. Ex-situ photoelectron spectroscopy measurements show little difference of the chemical composition of the surface after the respective treatments. The thermal treatment, however, gives rise to re-crystallisation of the copper film due to the difference in temperature of deposition and the anneal. Ex-situ ellipsometry measurements indicate that the hydrogen plasma not only removes Cu(OH)2·CuCO3 but also passivates the copper surface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 612: Symposium D – Materials, Technology & Reliability for Advanced Interconnects.. , 2000 , D9.17.1
Copyright
Copyright © Materials Research Society 2000

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References

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