Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-28T04:23:21.770Z Has data issue: false hasContentIssue false
  • English
  • Français

A Study of Impact Reliability of Lead-free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad

Published online by Cambridge University Press:  01 February 2011

Shengquan Ou ,
Yuhuan Xu ,
K. N. Tu ,
M. O. Alam  and
Y. C. Chan
Shengquan Ou
Affiliation:
Department of Materials Science and Engineering, UCLA, Los Angeles, CA, 90095-1595
Yuhuan Xu
Affiliation:
Department of Materials Science and Engineering, UCLA, Los Angeles, CA, 90095-1595
K. N. Tu
Affiliation:
Department of Materials Science and Engineering, UCLA, Los Angeles, CA, 90095-1595
M. O. Alam
Affiliation:
Department of Electrical Engineering, City University of Hong Kong, Kowloon, Hong Kong
Y. C. Chan
Affiliation:
Department of Electrical Engineering, City University of Hong Kong, Kowloon, Hong Kong
Get access

Abstract

The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground. The impact may cause interfacial fracture of wire-bonds or solder joints between a Si chip and its packaging module. Existing metrologies, such as ball shear, and pull test cannot well represent the shock reliability of the package. In this study, a micro-impact machine is utilized to test the impact reliability of three kinds of lead-free solders: 99Sn1Ag, 98.5Sn1Ag0.5Cu and 97.5Sn1Ag0.5Cu1In (hereafter called Sn1Ag, Sn1Ag0.5Cu, and Sn1Ag0.5Cu1In). The effect of thermal aging on the impact toughness is also evaluated in this study. We find a ductile-to-brittle transition in SnAg (Cu) solder joints after thermal aging. The impact toughness is enhanced by the thermal aging. This is a combination effect of the growth of intermetallic compound (IMC) at the interface provided strong bonding, and the softening of the solder bulk during the thermal aging absorbed more energy during plastic deformation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 863: Symposium B – Materials, Technology and Reliability of Advanced Interconnects , 2005 , B10.5
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Mishiro, Kinukoet al, “Effect of the drop impact on BGA/CSP package reliability,” Microelectronics Reliability, 42 (2002), pp. 77–82.Google Scholar
2. Nishiura, M, Nakayama, A, Sakatani, S, Kohara, Y, Uenishi, K, KF, Kobayashi, “Mechanical strength and microstructure of BGA joints using lead-free solders,” Mater Trans., 43 (2002), pp. 1802.Google Scholar
3. Chiu, Tz-Cheng, Zeng, Kejun, Stierman, Roger and Edwards, Darvin, Ano, Kazuaki, “Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages,” The proceedings of the 54th ECTC, Las Vegas, NV, 2004, pp.1256.Google Scholar
4. Shoji, T, Yamamoto, K, Kajiwara, R, Morita, T, Sato, K, Date, M., Proceedings of the 16th JIEP Annual Meeting, 2002, pp.97.Google Scholar
5. Date, M., Shoji, T., Fujiyoshi, M., Sato, K., and Tu, K. N., “Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test,” Scripta Materialia, 51 (2004), pp.641.Google Scholar
6. Holt, John M., editor, “Charpy Impact Test: Factors and Variables” ASTM STP 1072, Philadelphia, PA, (1990).Google Scholar
7. Zeng, K. and Tu, K. N., “Six cases of reliability study of Pb-free solder joints in electronic packaging technology,” Mater. Sci. Eng., R., 38 (2002), pp. 55.Google Scholar
8. Alam, M. O., Chan, Y. C., and Tu, K. N., “Effect of 0.5 wt.% Cu addition in the Sn-3.5% Ag solder on the interfacial reaction with Au/Ni metallization,” Chemistry of Materials, 15 (2003), pp.4340–4342.Google Scholar