Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Hayatsu, Yusuke
Iida, Tsutomu
Sakamoto, Tatsuya
Kurosaki, Shota
Nishio, Keishi
Kogo, Yasuo
and
Takanashi, Yoshifumi
2012.
Fabrication of large sintered pellets of Sb-doped n-type Mg2Si using a plasma activated sintering method.
Journal of Solid State Chemistry,
Vol. 193,
Issue. ,
p.
161.
Sakamoto, Tatsuya
Iida, Tsutomu
Taguchi, Yutaka
Kurosaki, Shota
Hayatsu, Yusuke
Nishio, Keishi
Kogo, Yasuo
and
Takanashi, Yoshifumi
2012.
Examination of a Thermally Viable Structure for an Unconventional Uni-Leg Mg2Si Thermoelectric Power Generator.
Journal of Electronic Materials,
Vol. 41,
Issue. 6,
p.
1429.
Nemoto, Takashi
Iida, Tsutomu
Sato, Junichi
Sakamoto, Tatsuya
Hirayama, Naomi
Nakajima, Tadao
and
Takanashi, Yoshihumi
2013.
Development of an Mg2Si Unileg Thermoelectric Module Using Durable Sb-Doped Mg2Si Legs.
Journal of Electronic Materials,
Vol. 42,
Issue. 7,
p.
2192.
Nemoto, Takashi
Iida, Tsutomu
Sato, Junichi
Suda, Hiroshi
and
Takanashi, Yoshifumi
2014.
Improvement in the Durability and Heat Conduction of uni-leg Thermoelectric Modules Using n-type Mg2Si Legs.
Journal of Electronic Materials,
Vol. 43,
Issue. 6,
p.
1890.
Ferrario, A.
Battiston, S.
Boldrini, S.
Sakamoto, T.
Miorin, E.
Famengo, A.
Miozzo, A.
Fiameni, S.
Iida, T.
and
Fabrizio, M.
2015.
Mechanical and Electrical Characterization of Low-resistivity Contact Materials for Mg2Si.
Materials Today: Proceedings,
Vol. 2,
Issue. 2,
p.
573.
Isoda, Yukihiro
Tada, Satoki
Kitagawa, Hiroyuki
and
Shinohara, Yoshikazu
2016.
Thermoelectric Properties of Sb-Doped Mg2Si Prepared Using Different Silicon Sources.
Journal of Electronic Materials,
Vol. 45,
Issue. 3,
p.
1772.
Shiojiri, Daishi
Iida, Tsutomu
Kakio, Hiroki
Yamaguchi, Masato
Hirayama, Naomi
and
Imai, Yoji
2022.
Enhancement of thermoelectric performance of Mg2Si via co-doping Sb and C by simultaneous tuning of electronic and thermal transport properties.
Journal of Alloys and Compounds,
Vol. 891,
Issue. ,
p.
161968.