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Acoustic Signature of Defects in SiC/Porous SiC Laminated Ceramics

Published online by Cambridge University Press:  10 February 2011

R. Esquivel-Sirvent  and
C. Noguez
R. Esquivel-Sirvent
Affiliation:
Instituto de Física UNAM, Apartado Postal 20–364, C.P. 01000 Mexico, D.F.
C. Noguez
Affiliation:
Instituto de Física UNAM, Apartado Postal 20–364, C.P. 01000 Mexico, D.F.
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Abstract

The sensitivity of acoustic techniques to topological and morphological variations in SiC/porous SiC laminated ceramics is studied using a transfer matrix formalism. To implement this transfer matrix technique, the mechanical properties of the SiC porous layers are characterized using the effective medium approximation of Kuster and Toksoz. We show that topological defects have a stronger acoustic signature than morphological defects. Also, we observe that there are particular frequencies at which the defects do not present any acoustic signature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 458: Symposium W – Interfacial Engineering for Optimized Properties , 1996 , 397
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

[1] Cook, J. and Gordon, J.E., Proc. R. Soc. A 282, 508–520 (1964).Google Scholar
[2] Krstic, V.D., MRS Bulletin 21, 46–49 (1995).Google Scholar
[3] Jacobs, J.A. and Kilduff, T.F., Engineering Materials Technology, (Prentice Hall International, Englewoods Cliffs, New Jersey), 1985.Google Scholar
[4] McGurn, A.R. and Maradudin, A.A., Physica A 207, 435–439 (1994).Google Scholar
[5] Olazagasti, E.L., Cocoletzi, G.H. and Mochan, W.L., Solid State Commun. 78, 9–12 (1991).Google Scholar
[6] Esquivel-Sirvent, R. and Cocoletzi, G.H., J. Acoust. Soc. Am. 95, 86–90 (1994).Google Scholar
[7] ASelfridge, R., IEEE Transactions on Sonics and Ultrasonics SU-32, 381–394 (1985).Google Scholar
[8] Kuster, G.T. and Toksoz, M.N., Geophysics 39, 587–606 (1974).Google Scholar
[9] James, R., Woodley, S. M., Dyer, C. M. and Humphrey, V. F., J. Acoust. Soc. Am. 97, 2041–2048 (1995).Google Scholar