Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-14T04:57:52.586Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesion Strength and Deformation Behavior of Al(Cu-Si)/BPDA-PDA Layered Structures

Published online by Cambridge University Press:  15 February 2011

P. Abramowitz ,
E. Ogawa ,
P. S. Ho  and
J. Wetzel
P. Abramowitz
Affiliation:
Center of Materials Science & Engineering, University of Texas, Austin, TX 78712
E. Ogawa
Affiliation:
Center of Materials Science & Engineering, University of Texas, Austin, TX 78712
P. S. Ho
Affiliation:
Center of Materials Science & Engineering, University of Texas, Austin, TX 78712
J. Wetzel
Affiliation:
Motorola, Inc., Advanced Materials Group, Austin, Tx 78721
Get access

Abstract

The adhesion of Al(Cu-Si) line structures on thin films of BPDA-PDA with different surface preconditioning were examined by measuring the deformation energy of the metal and interface. The properties of BPDA-PDA/Al(Cu-Si) were examined with atomic force microscopy (AFM). Although different sputtering treatments profoundly affect the adhesive properties, the sputtering does not appreciably change the topology of the BPDA-PDA. We also found evidence that even though the thickness of the interface can be very small (3–5 nm), the polymer/metal interface can greatly affect the deformation behavior of the entire system.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997 , 285
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Leu, J., Ho, P. S. and Chiu, S. L., Jouraal of Applied Physics. 76, 5143 (1994)Google Scholar
2. Chiu, S. L., Leu, J., and Ho, P.S., Journal of Applied Physics. 76, 5136 (1994)Google Scholar
3. Seok Kang, Y., PhD Thesis. 38(1996)Google Scholar
4. Poon, T. W., Leu, J., and Kasthurirangan, Jai, and Ho, P.S., Journal of Applied Physics, 76, 5515 (1994)Google Scholar
5. Wu, P. K., Dabral, S., Yang, G.-R., Gittleman, B., Li, C., McDonald, J.F., and Lu, T.-M. Journal of Applied Physics. 80, 5759(1996)Google Scholar
6. Granick, S., MRS Bulletin. 21, 33 (1996)Google Scholar
7. Hirth, J., and Lothe, J., Theory of Dislocations, 2nd edition (John Wiley & Sons, Inc., 1982), pg. 788 Google Scholar
8. Lin, K. M. and Lee, S., Phys. Stat. Sol. (a). 130, 305 (1992)Google Scholar
9. Lin, K. M. and Lee, S., Phys. Stat. Sol. (a). 120, 497 (1990)Google Scholar
10. Rao, S. I., Hazzledine, P. M. and Dimiduk, D. M. in Interfacial Strengthening in Semi-Coherent Metallic Multilayers edited by Otooni, M. A., Armstrong, R.W., Grant, N. J., and Ishizaki, K. (Mater. Res. Soc. Proc. 362, Boston, MA, 1994) pp. 67–79 Google Scholar