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An Evaluation on The Effects of Newly Designed Abrasives in CMP Slurry

Published online by Cambridge University Press:  18 March 2011

Nobuo Kawahashi  and
Masayuki Hattori
Nobuo Kawahashi
Affiliation:
Fine Electronic Research Laboratory, JSR Corporation 100 Kawajiri-cho, Yokkaichi, Mie, 510-8552, JAPAN
Masayuki Hattori
Affiliation:
Fine Electronic Research Laboratory, JSR Corporation 100 Kawajiri-cho, Yokkaichi, Mie, 510-8552, JAPAN
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Abstract

Newly designed abrasives with various particle morphology and component have been prepared and evaluated in terms of polish efficiency for CMP application. Polymer sphere with uniformed particle size and special functional group were prepared by soap-free emulsion polymerization. CMP slurry including polymer abrasives indicated characteristic properties such as dishing, erosion and low defectivity for metal and dielectric surface. This study has been also conducted on the preparation of composite particles consisting of polymer core covered with inorganic composition such as zirconium compound, titanium compound, SiO2 and Al2O3. The controlled hydrolysis and heterocoagulation systems were proposed as preparation methods of composite particles. 1st step Cu-CMP Slurry with composite particles as abrasion indicated an excellent dishing, erosion and their over-polish-margin. Particularly these composite particles were useful to prevent increasing scratch on the TEOS and low-k dielectric materials surface in 2nd step CMP process.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 671: Symposium M – Chemical-Mechanical Polishing 2001–Advances and Future Challenges , 2001 , M2.2
Copyright
Copyright © Materials Research Society 2001

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References

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