Hostname: page-component-745bb68f8f-l4dxg Total loading time: 0 Render date: 2025-02-05T21:24:17.986Z Has data issue: false hasContentIssue false
  • English
  • Français

An In-Situ Study of the Segregation and the Strain Relaxation During Growth of Gold and Nickel Ultrathin Films

Published online by Cambridge University Press:  10 February 2011

S. Labat ,
P. Gergaud ,
O. Thomas ,
B. Gilles  and
A. Marty
S. Labat
Affiliation:
MATOP UPRESA CNRS 6088, Faculté de St Jérôme 13397 Marseille, France.
P. Gergaud
Affiliation:
MATOP UPRESA CNRS 6088, Faculté de St Jérôme 13397 Marseille, France.
O. Thomas
Affiliation:
MATOP UPRESA CNRS 6088, Faculté de St Jérôme 13397 Marseille, France.
B. Gilles
Affiliation:
LTPCM UMR CNRS 5614, Domaine Universitaire de St Martin d'Hères, 38402 St Martin d'Hères, France.
A. Marty
Affiliation:
SP2M/DRFMC/CEA, Centre d'Etudes Nucléaires, 38054 Grenoble, France.
Get access

Abstract

We report on in-situ real time measurement of both stress and strain during growth of ultrathin layers, with submonolayer sensitivity. The in-plane parameter is measured by Reflection High Energy Electron Diffraction (RHEED) and the stress is determined via the measurement of the curvature. The system studied is Au/Ni (i.e. Au on Ni and Ni on Au). We have evidenced a large asymmetry in the two different growths: Au (on Ni) shows a progressive elastic strain relaxation whereas Ni (on Au) exhibits a strong interplay between the stress and the interfacial mixing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 562: Symposium L – Polycrystalline Metal & Magnetic Thin Films , 1999 , 189
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Thornton, J.A. and Hoffman, D.W., Thin Solid films 171, 5 (1989).Google Scholar
[2] Doljack, F.A. and Hoffman, R.W., Thin Solid Films 12, 71 (1972).Google Scholar
[3] Mattews, J.W. and Blakeslee, A.E., J. Cryst. Growth 37, 118 (1974).Google Scholar
[4] Srolovitz, D. J., Acta metall. 37, 621 (1989).Google Scholar
[5] Pain, A.P., Nix, W.D., Larson, B.M. and Clemens, B.M., Phys. Rev. B 47, 13730 (1993).Google Scholar
[6] Kern, R. and Muller, P., Surf. Sci. 392, 103 (1997).Google Scholar
[7] Bayle, P., Deutsch, T., Gilles, B., Lancon, F., Marty, A., Thibault, J., Colliex, C. and Tence, M., Mater. Res. Soc. Symp. Proc. 319 (1994).Google Scholar
[8] Labat, S., Pichaud, B., Thomas, O., Alfonso, C., Charai, A., Barrallier, L., Gilles, B. and Marty, A., Thin Solid Films 275, 29 (1996).Google Scholar
[9] Flinn, P.A., Gardner, D.S and Nix, W.D., IEEE Trans. Elec. Dev. ED-34 (1987) 689.Google Scholar
[10] Stoney, G.G., Proc. Roy. Soc. London Ser. A 82 (1909) 172.Google Scholar
[11] Brantley, W., J. Appl. Phys. 44 (1973) 534.Google Scholar
[12] Nakayama, N., Wu, L., Dohnomae, H., Shinjo, T., Kim, J. and Falco, C.M., J. Magn. Magn. Mat. 126, 71 (1993).Google Scholar
[13] Labat, S., Thomas, O., Gergaud, P., Charai, A., Alfonso, C., Barrallier, L., Gilles, B. and Marty, A., J. de Phys. IV 6, C7–135 (1996).Google Scholar
[14] Baker, S., Bain, J., Clemens, B. and Nix, W., Mat. Res. Soc. Symp. Proc. 343, 555 (1994).Google Scholar
[15] Streitz, F H., Cammarata, R.C. and Sieradzki, K., Phys. Rev B 49, 10707 (1994).Google Scholar
[16] Floro, J.A., Chason, E., Lee, S.R., Twesten, R.D., Hwang, R.Q. and Freund, L.B., J. Electr. Mat. 26, 969 (1997).Google Scholar
[17] Floro, J.A., Chason, E., Lee, S.R. and Petersen, G.A., App.Phys. Lett. 71, 1694 (1997).Google Scholar
[18] Sorokin, A. Schell and Tromp, R., Phys. Rev. Lett. 64, 1039 (1990).Google Scholar
[19] Labat, S., Gergaud, P., Thomas, O., Gilles, B., Marty, A., submitted to Phys. Rev. B (1999).Google Scholar
[20] Labat, S., Gergaud, P., Thomas, O., Gilles, B., Marty, A., submitted to Appl. Phys. Lett. (1999).Google Scholar