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Area Array Solder Joints for Passive Alignment

Published online by Cambridge University Press:  15 February 2011

John McGroarty ,
Boris Yost ,
Peter Børgesen  and
Che-Yu Li
John McGroarty
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Boris Yost
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Peter Børgesen
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering Cornell University Ithaca, NY
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Abstract

Passive alignment techniques using area array solder joints are currently under investigation as a cost effective method of achieving electro-optical interconnects in electronic packages. Several investigators have developed models that describe the shapes of and forces produced by the liquid solder drops during reflow. These models are reviewed to provide a scientific basis for the application of such techniques.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 423
Copyright
Copyright © Materials Research Society 1992

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