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Atomistic Modeling of Interfacial Diffusion in the Lamellar Li0 TiAl
Published online by Cambridge University Press: 15 February 2011
Abstract
Atomistic simulation employing many-body central-force potentials was performed to elucidate the diffusion mechanisms in the bulk and at lamellar interfaces assuming a vacancy mechanism. First the self- diffusion of Ti and Al in stoichiometric structures was studied. It was found that the diffusion was faster along lamellar interfaces than in the bulk; the effective activation energy for the diffusion coefficient is about ∼15% lower. The simulations were then extended to investigate diffusion along lamellar boundaries with segregated Ti which is likely in Ti rich alloys. The surprising result is that diffusion remains practically unchanged when compared with the stoichiometric case. The reason is that while the path controlling the diffusion is different, the corresponding effective formation and migration energies are practically the same as in the stoichiometric case.
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- Copyright © Materials Research Society 2000