Hostname: page-component-6bf8c574d5-qdpjg Total loading time: 0 Render date: 2025-02-22T07:49:34.075Z Has data issue: false hasContentIssue false
  • English
  • Français

Bismaleimide/Allylnadic-Imide Blends Yield Low Dielectric Constant And Low Water Uptake

Published online by Cambridge University Press:  15 February 2011

J-PH Ansermet  and
A. Kramer
J-PH Ansermet
Affiliation:
Materials Research CIBA-GEIGY Ltd., 1701 Fribourg, Switzerland
A. Kramer
Affiliation:
Plastics Research CIBA-GEIGY Ltd., 1701 Fribourg, Switzerland
Get access

Abstract

The bismaleimide resin Matrimid 5292A (I) was cocured with an allylnadic-imide resin (EP 433) which contained a long aliphatic chain as backbone (II). Water uptake, swelling, and the dielectric properties (up to 300 MHz) were studied in cast plates. The dielectric constant varied from 5.4 in (I) to 3.2 in (II) at water saturation, compared to 3.1 in (I) to 2.7 in (II) in the dry state. The glass transition temperature stayed above 200 °C at less than 80 mol% of (II).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 155
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. e.g. Wiesner, E. (Hewlett Packard), Proc. NEPCON WEST 1990 Google Scholar
2. Doeling, W. et al., in Microelectronics Interconnects and Packaging, edited by Lyman, J., (McGraw Hill 1980), p. 140 Google Scholar
3. Gilbert, B.K., in Packaging and Interconnection of GaAs Digital Integrated Circuits, VLSI Electronics Microstructure Science 11, (Academic Press 1985)Google Scholar
4. Doyle, G.J., Sheehan, B.J., Circuit Manufacturing, Dec. 1987, p. 42–46 Google Scholar
5. Cangellaris, A.C. et al., Proc. NEPCON West 1990, p. 215 Google Scholar
6. Denton, D.D., Moisture Transport in Polyimide Films in Integrated Circuits, PhD Thesis, MIT, 1987 Google Scholar
7. Aldrich, P.D., Thurow, S.K., McKennon, M.J., Lyssy, M.E., Polymer 28, 2289 (1987)CrossRefGoogle Scholar
8. Beuhler, A.J. et al., ACS Proc. Pol. Sci. Eng. 1988, 339 Google Scholar
9. Denton, D., Ho, C.N., IEEE Trans. Instr. Meas. 39(3), 508 (1990)Google Scholar
10. Kramer, A., Schmid, R., in Advances in Polymer Blends and Alloys Technology, volume III, (Technomic Pub. to be published)Google Scholar
11. Kramer, A. et al., SAMPE Anaheim 1990 Google Scholar
12. a. Weiss Technik GmbH, D-6301 Reiskirchen Germany b. Rotronic DV-2, Instrument Corp., Huntington N.Y. 11743 c.DETA Polymer Laboratories Inc., Amherst, MA 01002, USA d.Hewlett Packard 4191A and 4192A e.DuPont TA9900 (DSC, DMA, TMA), Mettler TA2000C (TGA), Perkin Elmer TAS7 (TMA)Google Scholar
13. Blythe, A.R., Electrical Properties of Polymers, (Cambridge Uni. Press, 1979)Google Scholar
14. Maxwell, I.D., Pethrick, R.A., J. Appl. Polym. Sci. Technol. 28, 2363 (1983)Google Scholar
15. Reed, J.D. et al., J. Appl.Pol.Sci.Technol. 31,1771(1986)Google Scholar
16. Adamson, M.J., Proc. Annu. Program Rev/Workshop 5th(1987)Google Scholar