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CeO2 Particles for Chemical Mechanical Planarization

Published online by Cambridge University Press:  01 February 2011

Xiandong Feng ,
Yie-Shein. Her ,
W. Linda. ,
Jackie Davis ,
Eric Oswald ,
Jin Lu ,
Vicky Bryg ,
Sara Freeman  and
Dave Gnizak
Xiandong Feng
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Yie-Shein. Her
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Jackie Davis
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Eric Oswald
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Jin Lu
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Vicky Bryg
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Sara Freeman
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
Dave Gnizak
Affiliation:
Electronic Materials Systems, Ferro Corporation 7500 E. Pleasant Valley, Independence, OH 44131, U.S.A.
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Abstract

Nano-sized cerium oxide particles in the size range of 5 to 500nm have been synthesized for use in chemical mechanical planarization (CMP) applications. The CeO2 particles were prepared using cerium nitrate salts with bases such as ammonium water, ethylamine, or other alkylamine /polyalkylamine compounds. Other additives such as urea can be added to affect crystallization and size growth of the final particles. The particle sizes of the resulting CeO2 particles depend on the initial concentrations of cerium salts, additive concentration, and solution pH. Reaction duration seems to have little effect on CeO2 particle sizes. Temperature effects on size were moderate. These CeO2 particles showed excellent surface quality and desirable polishing rate during CMP tests.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F3.8
Copyright
Copyright © Materials Research Society 2003

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