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Characterization Study of Al-Plug Technology

Published online by Cambridge University Press:  15 February 2011

H. H. Hoang ,
F. S. Chen ,
T. E. Turner ,
Y. S. Lin ,
G. A. Dixit  and
F. T. Liou
H. H. Hoang
Affiliation:
SGS-THOMSON MICROELECTRONICS, 1310 Electronics Drive, M/S 742, Carrollton, TX 75006
F. S. Chen
Affiliation:
SGS-THOMSON MICROELECTRONICS, 1310 Electronics Drive, M/S 742, Carrollton, TX 75006
T. E. Turner
Affiliation:
SGS-THOMSON MICROELECTRONICS, 1310 Electronics Drive, M/S 742, Carrollton, TX 75006
Y. S. Lin
Affiliation:
SGS-THOMSON MICROELECTRONICS, 1310 Electronics Drive, M/S 742, Carrollton, TX 75006
G. A. Dixit
Affiliation:
SGS-THOMSON MICROELECTRONICS, 1310 Electronics Drive, M/S 742, Carrollton, TX 75006
F. T. Liou
Affiliation:
SGS-THOMSON MICROELECTRONICS, 1310 Electronics Drive, M/S 742, Carrollton, TX 75006
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Abstract

This work investigates the reliability issues associated with an aluminum sputter process, called the Al-plug process, that results in the complete filling of submicron contacts and vias of various sizes. The state-of-the-art Al-plug technology has proven its superiority over conventional processes due to its process simplicity and complete elimination of metal step-coverage problems and dielectric voiding over contacts/vias, resulting in higher reliability. Materials and electrical characterization of this metal process are presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 225: Symposium G – Materials Reliability Issues in Microelectronics , 1991 , 79
Copyright
Copyright © Materials Research Society 1991

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References

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