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Chemistry, Bonding and Fracture of Grain Boundaries in Ni3Si

Published online by Cambridge University Press:  15 February 2011

Shanthi Subramanian ,
David A. Muller ,
John Silcox  and
Stephen. L. Sass
Shanthi Subramanian
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY. 14853
David A. Muller
Affiliation:
Department of Applied and Engineering Physics, Cornell University, Ithaca, NY. 14853
John Silcox
Affiliation:
Department of Applied and Engineering Physics, Cornell University, Ithaca, NY. 14853
Stephen. L. Sass
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY. 14853
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Abstract

To obtain insight into the effect of dopants on the bonding and cohesive energy of gram boundaries in Ll2 intermetallic compounds, the chemistry and electronic structure at grain boundaries in B-free and B-doped Ni-23 at % Si alloys were examined, with electron energy loss spectroscopy (EELS) providing information on the former and energy dispersive X-ray spectroscopy (EDX) on the latter. Ni-enrichment was seen at large angle boundaries, both in the absence and presence of B. EELS of the Ni L3 edge showed that the bonding at Ni-rich grain boundaries was similar in both undoped and doped alloys. Comparison of the Ni L3 edge recorded at the grain boundary and in the bulk suggests that reduced hybridization and weaker bonding occurs at Ni-rich grain boundaries in both doped and undoped alloys. These changes in bonding are interpreted in terms of changes in the cohesive energy of the boundaries.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 460: Symposium Z – High-Temperature Ordered Intermetallic Alloys VII , 1996 , 647
Copyright
Copyright © Materials Research Society 1997

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References

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