Published online by Cambridge University Press: 26 February 2011
Plasma-deposited a-Si:C:H and a-Si:N:H alloys both show a rapidly rising hydrogen incorporation with increasing carbon or nitrogen content. For hydrogen concentrations exceeding ∼ 20 at.%, the host material starts to lose its connectiveness leading to the formation of a void structure as evidenced by hydrogen evolution and infrared absorption. Raising the substrate temperature leads to a reduction of the hydrogen concentration, to an increase of the Si-C and Si-N bond concentration and to a more compact naterial. However, for a-Si:C:H films it leads also to graphitic carbon bonds. The widening of the optical bandgap of a-Si:C:H films up to about 50 at.% of carbon is almost entirely due to the increased hydrogen incorporation whereas for a-Si:N:H films both hydrogen and nitrogen incorporation plays a role.