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Control of Long-Lived Gas Emissions From Semiconductor Processing Equipment

Published online by Cambridge University Press:  15 February 2011

Michael T. Mocella
Michael T. Mocella*
Affiliation:
DuPont Fluoroproducts, P21-2162, Wilmington, DE, 19880-0021
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Abstract

Certain perfluorocompounds (PFCs) - including CF4, C2F6, SF6, and NF3 - are widely used in gas phase thin film processing applications such as dry etching and CVD chamber cleaning. Through a combination of long atmospheric lifetimes and high infrared absorption cross sections, many PFCs have high global warming potentials (GWPs). Abatement of PFC emissions from semiconductor applications is consistent with existing and developing international, national, and industrial policies for the control of greenhouse gas emissions. For PFC applications in the semiconductor industry, there exist a number of promising options for emissions control. These options include destruction (comprising combustion, plasma, and chemical-thermal routes), recovery, and process replacement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 344: Symposium I – Materials and Processes for Environmental Protection , 1994 , 255
Copyright
Copyright © Materials Research Society 1994

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References

1. Mocella, M. T., Journal of the Semiconductor Safety Association, submitted for publication. This publication, and all other DuPont-referenced papers and bulletins, may be obtained on request from the author (phone 302–892-0870; FAX 302–992-6664).Google Scholar
2. “C2F6 Emissions Reduction from Semiconductor Processing Tools: First Status Report on Technology and Equipment”, DuPont Fluoroproducts Technical Bulletin, December, 1993.Google Scholar
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