Hostname: page-component-6bf8c574d5-t27h7 Total loading time: 0 Render date: 2025-02-22T23:37:01.973Z Has data issue: false hasContentIssue false
  • English
  • Français

Cross-Sectional TEM Studies of DIGM in Irradiated Au-Cu Bilayers

Published online by Cambridge University Press:  25 February 2011

Yuzun Gao ,
Dale E. Alexander  and
L. E. Rehn
Yuzun Gao
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439
Dale E. Alexander
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439
L. E. Rehn
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439
Get access

Abstract

Cross-sectional transmission electron microscopy was used to study diffusion-induced grain boundary migration (DIGM) in irradiated and annealed Au/Cu bilayers. Using this technique, in combination with small probe X-ray energy dispersive spectroscopy, DIGM alloyed zones in Au were identified in an irradiated sample.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 279: Symposium A – Beam-Solid Interactions–Fundamentals and Applications , 1992 , 369
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Prasad, S. K., Herman, H., King, A. H. and Goland, A., in Proceedings Electron Microscopy Society of America, Fortieth Annual Meeting, edited by Bailey, G. W. (Claitor's Publishing Division, San Francisco, CA, 1982), pp. 634–635.Google Scholar
[2] Handwerker, C. A. in Diffusion Phenomena in Thin Films and Microelectronic Materials, edited by Gupta, D. and Ho, P. S. (Noyes Publications, Park Ridge, NJ, 1988), pp. 245–322.Google Scholar
[3] Alexander, D. E., Rehn, L. E. and Baldo, P. M., in Phase Formation and Modification by Beam-Solid Interactions, edited by Was, G. S., Rehn, L. E. and Follstaedt, D. M. (Materials Research Society, Pittsburgh, PA, 1992), pp. 559–564.Google Scholar
[4] Alexander, D. E., Rehn, L. E., Baldo, P. M. and Gao, Y., submitted to Appl Phys. Lett.Google Scholar
[5] Chou, T. C., Wong, C. Y. and Tu, K. N., Appl Phys. Lett. 49, 1381–1383 (1986).Google Scholar
[6] EMSA Bulletin 17, 94 (1987).Google Scholar
[7] Pan, J. D. and Balluffi, R. W., Acta. Metall. 30, 861–870 (1982).Google Scholar