Published online by Cambridge University Press: 21 March 2011
We have developed an electrodeposition bath based on a buffer solution so that the stability of the electrodeposition process is enhanced and no metal oxides or hydroxides precipitate out of solution. The buffer-solution-based bath also deposits more gallium in the precursor films. Asdeposited precursors are stoichiometric or slightly Cu-rich CuIn1−XGaXSe2 (CIGS). Only a minimal amount of indium was added to the electrodeposited precursor films by physical vapor deposition to obtain a 9.4%-efficient device.