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Determination of the Planarization Distance for Copper CMP Process

Published online by Cambridge University Press:  10 February 2011

S Hymes ,
K. Smekalin ,
T. Brown ,
H. Yeung ,
M. Joffe ,
M. Banet ,
T Park ,
T. Tugbawa ,
D. Boning  and
J. Nguyen
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S Hymes
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, Texas, 78741–6499;
K. Smekalin
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, Texas, 78741–6499; National Semiconductor Corp., 2900 Semiconductor Drive, M/S E-100, Santa Clara, CA 95051;
T. Brown
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, Texas, 78741–6499;
H. Yeung
Affiliation:
Philips Analytical Systems, 12 Michigan Drive, Natick, MA 01760;
M. Joffe
Affiliation:
Philips Analytical Systems, 12 Michigan Drive, Natick, MA 01760;
M. Banet
Affiliation:
Philips Analytical Systems, 12 Michigan Drive, Natick, MA 01760;
T Park
Affiliation:
Microsystems Technology Laboratories, EECS Department, MIT, 60 Vassar Street, Room 39–567B, Cambridge, MA 02139;
T. Tugbawa
Affiliation:
Microsystems Technology Laboratories, EECS Department, MIT, 60 Vassar Street, Room 39–567B, Cambridge, MA 02139;
D. Boning
Affiliation:
Microsystems Technology Laboratories, EECS Department, MIT, 60 Vassar Street, Room 39–567B, Cambridge, MA 02139;
J. Nguyen
Affiliation:
IPEC Corporation, 4717 East Hilton Ave, Phoenix AZ, 85034;
T. West
Affiliation:
T. West, W. Sands, Thomas West Inc.470 Mercury Drive, Sunnyvale, CA, 94086.
W. Sands
Affiliation:
T. West, W. Sands, Thomas West Inc.470 Mercury Drive, Sunnyvale, CA, 94086.
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Abstract

A planarization monitor has been applied to the copper system to investigate pattern dependencies during copper overburden planarization. Conventional profilometry and a noncontact, acousto-optic measurement tool, the Insite 300, are utilized to quantify the planarization performance in terms of the defined step-height-reduction-ratio (SHRR). Illustrative results as a function of slurry, pad type and process conditions are presented. For a typical stiff-pad copper CMP process, we determined the planarization distance to be approximately 2mm.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 211
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

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