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Determination of Thermal Parameters of Nanostructures Exhibiting One-Dimensional Heat Flow Through a Thermal Transient Method

Published online by Cambridge University Press:  31 January 2011

Anton Arriagada ,
Edward T Yu  and
Prabhakar Bandaru
Anton Arriagada
Affiliation:
aarriaga@ucsd.edu, University of California, San Diego, Electrical and Computer Engineering, La Jolla, California, United States
Edward T Yu
Affiliation:
ety@ece.ucsd.edu, University of California, San Diego, Electrical and Computer Engineering, La Jolla, California, United States
Prabhakar Bandaru
Affiliation:
pbandaru@ucsd.edu, UC, San Diego, Mechanical and Aerospace Engineering, La Jolla, California, United States
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Abstract

We present an improved methodology for a thermal transient method enabling simultaneous measurement of thermal conductivity and specific heat of nanoscale structures with one-dimensional heat flow. The temporal response of a sample to finite duration heat pulse inputs for both short (1 ns) and long (5μs) pulses is analyzed and exploited to deduce the thermal properties. Excellent agreement has been obtained between the recovered physical parameters and computational simulations.

Keywords

thermal conductivitynanoscalesimulation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1172: Symposium T – Nanoscale Heat Transport–From Fundamentals to Devices , 2009 , 1172-T05-05
Copyright
Copyright © Materials Research Society 2009

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References

[1] Carslaw, H. S. Jaeger, J. C. Conduction of Heat in Solids, Claredon Press, Oxford, 1959.Google Scholar
[2] Bertman, B. Heberlein, D. C. Sandiford, D. J. Shen, L. Wagner, R. R. Cryogenics 10 (1970) 326–327.Google Scholar
[3] Gershenson, M. Alterovitz, S. Applied Physics A: Materials Science & Processing 5 (1975) 329–334.Google Scholar
[4] Ghate, P. B. Electromigration-Induced Failures in VLSI Interconnects, in: Reliability Physics Symposium, 1982. 20th Annual, 1982, pp. 292–299.Google Scholar
[5] Alterovitz, S. Gershenson, M. Journal of Computational Physics 19 (1975) 121–133.Google Scholar
[6] Doetsch, G. Guide to the Application of the Laplace and z-Transforms Van Nostrand, London, 1971.Google Scholar
[7] Shapira, Y. Alterovitz, S. A. Journal of Thermal Analysis and Calorimetry 18 (1980) 477–491.Google Scholar
[8] Alterovitz, S. Deutscher, G. Gershenson, M. Journal of Applied Physics 46 (1975) 3637–3643.Google Scholar
[9] Bortner, L. J. Newrock, R. S. Resnick, D. J. Journal of Applied Physics 61 (1987) 4452–4457.Google Scholar
[10] Filler, R. L. Lindenfeld, P. Deutscher, G. Review of Scientific Instruments 46 (1975) 439–442.Google Scholar
[11] Cruz-Uribe, A., Trefny, J. U. Journal of Physics E: Scientific Instruments 15 (1982) 1054–1059.Google Scholar
[12] Madsen, J. Trefny, J. Journal of Physics E: Scientific Instruments 20 (1987) 1362–1365.Google Scholar
[13] Li, D. Wu, Y. Kim, P. Shi, L. Yang, P. Majumdar, A. Applied Physics Letters 83 (2003) 2934–2936.Google Scholar
[14] Lide, D. R. (Ed.) CRC Handbook of Chemistry and Physics, CRC Press/ Taylor and Francis, Boca Raton, 2008, p.Google Scholar