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Diode Laser Bonding of Planar MEMS, MOEMS, & Microfluidic Devices

Published online by Cambridge University Press:  01 February 2011

Jie-Wei Chen ,
Jerry Zybko  and
James Clements
Jie-Wei Chen
Affiliation:
Leister Process Technologies, Riedstr. CH-6060, Switzerland
Jerry Zybko
Affiliation:
Leister Technologies, LLC, Glen Ellyn, IL 60137, U.S.A.
James Clements
Affiliation:
NanoSciences, Inc. Aliso Viejo, CA 92656, U.S.A.
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Abstract

The assembly of plastic microfluidic devices, MOEMS and microarrays requiring high positioning and welding accuracy in the micrometer range, has been successfully achieved using a new technology based on laser transmission welding combined with a photolithographic mask technique. This paper reviews a laser assembly platform for the joining of microfluidic plastic parts with its main related process characteristics and its potential for low-cost and high volume manufacturing. The system consists of a of diode laser with a mask and an automated alignment function to generate micro welding seams with freely definable geometries. A fully automated mask alignment system with a resolution of < 2 μm and a precise, non-contact energy input allows a fast welding of micro structured plastic parts with high reproducibility and excellent welding quality.

Keywords

laser weldingmask techniquemicrofluidicpolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 872: Symposium J – Micro- and Nanosystems—Materials and Devices , 2005 , J15.6
Copyright
Copyright © Materials Research Society 2005

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