Published online by Cambridge University Press: 28 February 2011
The adsorption and decomposition of disilane on the Ge(111) surface has been investigated using multiple internal reflection infrared spectroscopy (MIRIRS). At temperatures ≤ 110 K, Si2H6 weakly bonds to the Ge surface in a molecular fashion. Upon mild heating to temperatures between 110 - 150 K, both desorption and dissociation occur. Dissociative adsorption also occurs upon exposure at temperatures > 110 K. Molecular adsorption is no longer observed for exposure at temperatures above 150 K. Detection of the low frequency deformation modes provides direct evidence for dissociation of the Si-Si bond between 120 - 150 K. The primary species present at 150 K is silyl, SiH3. Si-H bond scission takes place from 150 - 500 K, resulting in GeH formation. Production of SiH2 and SiH is spectroscopically identified in this temperature range.