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Effect of Tool Kinematics, Brush Pressure and Cleaning Fluid pH on Coefficient of Friction and Tribology of post-CMP PVA Brush Scrubbing Processes

Published online by Cambridge University Press:  01 February 2011

Ara Philipossian  and
Lateef Mustapha
Ara Philipossian
Affiliation:
Department of Chemical and Environmental EngineeringThe University of Arizona, Tucson, AZ 85721 USA
Lateef Mustapha
Affiliation:
Department of Chemical and Environmental EngineeringThe University of Arizona, Tucson, AZ 85721 USA
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Abstract

Real-time coefficient of friction (COF) analysis is used to determine the extent of normal and shear forces during post-CMP PVA brush scrubbing and identify the tribology of the process. Fluid pH and applied pressure have pronounced effects on process tribology and the magnitude of COF. In cases where brush rotation is the only kinematic attribute of the system, low pH results in ‘mixed lubrication’ where increasing brush velocity causes a dramatic reduction in COF in accordance with classical tribological arguments. At lower pressures the tribological mechanism shifts to ‘hydrodynamic lubrication’ with significantly lower values of COF. Regardless of pressure, increasing the pH to 7 and 10.7 causes the tribology to remain in ‘hydrodynamic lubrication’ and results in even lower values of COF. Trends are explained qualitatively by considering the effect of pH on the solubility and gellation characteristics of silica in the silica-water system. Stribeck curves fail to shed light on the tribology of the system when complex ranges of tool kinematics (i.e. wafer rotation and brush oscillation superimposed on brush rotation) are employed. The results are counter-intuitive since they indicate nearly an order of magnitude increase in COF with increasing brush velocity. Nevertheless, results demonstrate the utility of having complex ranges of motion in PVA brush scrubbing such that very low or very high values of COF can be realized by simply increasing the rotational velocity of the brush while maintaining a constant wafer rotation and brush oscillation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F5.8
Copyright
Copyright © Materials Research Society 2003

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