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Electrochemical Deposition of Bismuth Micro- and Nanowires Using Electroplate and Lift Lithography

Published online by Cambridge University Press:  15 January 2013

Timea Hohl ,
Lori A. Lepak ,
Andrew Zimmerman ,
Samuel Hempel ,
Anirudha V. Sumant ,
Ralu Divan ,
C. Suzanne Miller ,
Daniel Rosenmann ,
Christopher Verzani  and
Endre Takács
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Timea Hohl
Affiliation:
University of Wisconsin – Stevens Point, WI 54481, U.S.A. University of Debrecen, Debrecen, H-4010, Hungary
Lori A. Lepak
Affiliation:
University of Wisconsin – Stevens Point, WI 54481, U.S.A.
Andrew Zimmerman
Affiliation:
University of Wisconsin – Stevens Point, WI 54481, U.S.A.
Samuel Hempel
Affiliation:
University of Wisconsin – Stevens Point, WI 54481, U.S.A.
Anirudha V. Sumant
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, IL 60439, U.S.A.
Ralu Divan
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, IL 60439, U.S.A.
C. Suzanne Miller
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, IL 60439, U.S.A.
Daniel Rosenmann
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, IL 60439, U.S.A.
Christopher Verzani
Affiliation:
University of Wisconsin – Stevens Point, WI 54481, U.S.A.
Endre Takács
Affiliation:
University of Debrecen, Debrecen, H-4010, Hungary
Michael P. Zach
Affiliation:
University of Wisconsin – Stevens Point, WI 54481, U.S.A.
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Abstract

Patterned micro- and nanowires of several compositions in the solution series of BixTey were electrochemically deposited using Electroplate and Lift (E&L) Lithography on Ultrananocrystalline Diamond (UNCD) templates. The composition of the deposited BixTey wires was controlled by mixing saturated solutions of bismuth nitrate and tellurium in various ratios in the electroplating bath. All wires were electroplated via pulsed depositions at -1.4V vs. the saturated calomel electrode (SCE). The morphology and composition of all wires were studied by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). In general, the BixTey wires were fine-grained and brittle, often fracturing during the liftoff process. By contrast, wires containing less than 5% Te are smooth, and strong enough to support their own weight without a supporting medium for a length of over 100 times the wire diameter.

Keywords

electrochemical synthesislithography (deposition)Bi
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1477: Symposium S1A – Low-Dimensional Bismuth-based Materials , 2012 , imrc12-1477-s1a-o006
Copyright
Copyright © Materials Research Society 2012 

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References

REFERENCES

Sootsman, J., Chung, D. and Kanatzidis, M., Angewandte Chemie International Edition, 2009, 48: 8616–8639 10.1002/anie.200900598CrossRefGoogle Scholar
Dresselhaus, Mildred, Perspectives on Recent Advances in Thermoelectric Materials Research, Thermoelectrics Applications Workshop, September 30, 2009 Google Scholar
Menke, E. J., Brown, M. A., Li, Q., Hemminger, J. C. and Penner, R. M., Langmuir, 2006, 22 (25), pp 10564–10574.10.1021/la061275gCrossRefGoogle Scholar
Seley, D. B., Dissing, D. A., Sumant, A. V., Divan, R., Miller, S., Auciello, O., Lepak, L. A., Terrell, E. A., Shogren, T. J., Fahrner, D. A., Hamilton, J. P., Zach, M. P., ACS Apl. Mater. Interfaces, 2011, 3(4), pp 925–930.10.1021/am101226wCrossRefGoogle Scholar
Jones, D., Lepak, L. A., Sumant, A. V., Divan, R., Auciello, O., Seley, D. B., Dissing, D. A., Miller, S., Rosenmann, D., Daniels, E., Gervais, R., and Zach, M. P., MA 2011, Proc. Mater. Res. Soc., doi: 10.1557/opl.2012.664, published online 30 March 2012 CrossRefGoogle Scholar
Grodek, C., Lepak, L. A., Sumant, A. V., Divan, R., Auciello, O., Rosenmann, D., Miller, S., Daniels, E., and Zach, M. P., MA 2011, Proc. Mater. Res. Soc. doi: 10.1557/opl.2012.247, published online 13 February 2012 CrossRefGoogle Scholar
All Bi stock solutions were 0.72M. For electroplating mixtures < 20% Te, a Te stock solution of 0.036M was mixed with Bi stock as follows: 5mL Te/20mL Bi (1.2% Te); 12mL Te/18mL Bi (3.2% Te); 10mL Te/10mL Bi (4.7% Te); 18mL Te/12mL Bi (6.9% Te); 20mL Te/10mL Bi (8.8% Te); 20mL Te/5mL Bi (16.6% Te). For electroplating mixtures > 20% Te, a Te stock solution of 0.061M was mixed with the Bi stock as follows: 19mL Te/6mL Bi (21.2% Te); 21mL Te/4 mL Bi (30.7% Te); 22mL Te/3mL Bi (38.2% Te); 23mL Te/2mL Bi (49.2% Te); 24mL Te/1mL Bi (66.9% Te); and 49mL Te/1mL Bi (80.5% Te) +20%+Te,+a+Te+stock+solution+of+0.061M+was+mixed+with+the+Bi+stock+as+follows:+19mL+Te/6mL+Bi+(21.2%+Te);+21mL+Te/4+mL+Bi+(30.7%+Te);+22mL+Te/3mL+Bi+(38.2%+Te);+23mL+Te/2mL+Bi+(49.2%+Te);+24mL+Te/1mL+Bi+(66.9%+Te);+and+49mL+Te/1mL+Bi+(80.5%+Te)>Google Scholar