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Electron Beam Excited Plasma CVD for Silicon Growth
Published online by Cambridge University Press: 09 August 2011
Abstract
Electron beam excited plasma (EBEP) CVD is a novel fabrication route for poly Si. Deposition was carried out on Si and SiO2 layer from pure SiH4 without hydrogen dilution. Crystalline silicon (μc-Si:H) films were made with electron acceleration voltage, discharge current, source gas flow rate, chamber presser, substrate temperature varied systematically. Average grain size was about 10 nm. Crystalline ratio was up to 0.7 at the maximum. The films contain about 19 at% hydrogen in spite of no dilution. It is considered that EBEP supplies much about atomic hydrogen due to the high decomposability of the source gas.
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- Copyright © Materials Research Society 1999
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