Published online by Cambridge University Press: 22 February 2011
Laser reflectometry has been shown to be a useful tool for etch depth measurements during etching of multiple layer structures. We have extended the use of laser reflectometry to accurately determine the etch rates of GaAs, Al0.4Ga0.6As and AlAs as a function of temperature and to verify layer thickness in-situ. By use of computer simulation we compare a theoretical model to actual data to determine layer thicknesses and accurate etch rates. We compare our data to previously published work for GaAs etching.