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Evaluation of Crack Growth Retardation Effect Due to Nano-scale Voids Based on Molecular Dynamics Method

Published online by Cambridge University Press:  22 March 2011

Shin Taniguchi  and
Toshihiro Kameda
Shin Taniguchi
Affiliation:
Graduate Student, University of Tsukuba, Tennodai1-1-1, Tsukuba, Ibaraki, Japan, 305-8573
Toshihiro Kameda
Affiliation:
University of Tsukuba, Tennodai1-1-1, Tsukuba, Ibaraki, Japan, 305-8573
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Abstract

This study has investigated the crack growth retardation effect due to plural nano-scale voids in Cu single crystals using a molecular dynamics (MD) method. Focusing on an interaction between nano-scale voids and dislocations, we have evaluated the optimum placement for crack growth retardation. MD simulations showed that the dislocation activity was further enhanced due to plural nano-scale voids continuously placed on the primary slip direction. The significant ductility enhancement and slight yield stress increase due to the crack shielding effect of nano-scale voids were observed.

Keywords

ductilitystress/strain relationshipnanoscale
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1297: Symposium P – Deformation Mechanisms, Microstructure Evolution and Mechanical Properties of Nanoscale Materials , 2011 , mrsf10-1297-p03-20
Copyright
Copyright © Materials Research Society 2011

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References

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